HOME |
APPLICATIONS |
PACKAGING |
PRODUCTS |
CONTACT |
 |
 |
 |
 |
 |
STG – Silicone based thermally conductive grease compounds specifically formulated with binding agents and highly conductive ceramic fillers to stop bleed and separations and to deliver low Thermal resistance (0.014 °C-in2/W) and very high Thermal Conductivity (3.7 W/m, °K) than films, pads, or thermoplastics. Excellent wetting and spread-ability makes it the best choice for thin bond film applications.
|
PRODUCT |
|
STG-40 |
STG-41 |
STG-42 |
STG-43 |
STG-44 |
|
Consistency |
|
Thixotropic Paste |
||||
|
Specific Gravity |
@25°C |
2.2 |
2.5 |
2.2 |
2.0 |
1.7 |
|
Color |
|
White |
White |
Gray |
Black |
Black |
|
Evaporation @200°C, 24 hrs |
% WT |
0.4 |
0.6 |
0.6 |
0.2 |
0.2 |
|
Thermal Conductivity |
W/m°K |
0.8 |
2.0 |
2.7 |
2.7 |
3.7 |
|
Thermal Resistance |
°C-in2/W |
0.05 |
0.025 |
0.018 |
0.018 |
0.014 |
|
Dielectric Strength |
V/mil |
390 |
410 |
405 |
310 |
335 |
|
Volume Resistivity |
Ohm-cm |
2.6x1014 |
2.2x1014 |
2.6x1014 |
3.8x1012 |
5.8x1012 |
|
Operating Temperature Range |
|
-55°C to 205°C |
||||
DISCLAIMER: All data given here is offered as a guide to the use of these materials and not as a guarantee of their performance. The user should evaluate their suitability for own purposes. Properties are typical and should not be used in preparing specifications. Statements are not to be construed as recommendations to infringe any patent.