MICROELECTRONIC ADHESIVES (ELECTRICALLY NON CONDUCTIVE)

DIE ATTACH ■ SUBSTRATE ATTACH ■ HEAT SINK ■ LEAD SEALING
 

FEATURES

APPLICATIONS

Product

Shelf Life

Pot Life

Sp. Gravity

Viscosity @ 25°C (cps)

Cure Schedule

Coefficient of Thermal Expansion

 (10^-6/°C)

Tg (°C)

Operating Temp. Range

Thermal Conductivity (W/m°K)

Volume Resistivity (Ohm-cm)

-40°C to 25°C

25°C to 120°C

Ø   Low thermal expansion

Ø   Good moisture resistance

Ø   Excellent thermal cycle performance

Ø   One and two components

Ø   Very good adhesion

Ø     Substrate Attach

Ø     Lid Seal

Ø     SMD Attach

Ø     Stacking component

Ø     Die Attach applications

o   Chip-On-Board

o   LED

o   TCP

o   MCM-L,C, & D

EB-316TM

1 year @ 25°C

45 Min @25°c

1.35

Paste

1 hrs @ 160°C

77

-

109

-55°C to 150°C

0.5

3x10¹³

EB-315

1 year @ 25°C

90 Min @25°c

1.8

Paste

1 hrs @ 175°C

25

40

182

-55°C to 230°C

0.7

2x10¹⁵

EB-350-3T

4 months @ 25°C

20 Min @80°C

1.5

Non-Sag Paste

1 hrs @ 150°C

32

41

120

-55°C to 150°C

1.0

1x10¹⁵

EB-402-1

1 year @

-40°C

12 Min @ 125°C

2.14

>250,000

2 hrs @ 125°C

24

33

145

-55°C to 150°C

1.8

2x10¹⁵

EB-403-1

1 year @

-40°C

30 Min @80°C

2.1

Non-Sag Paste

1/2 hr @ 150°C

28

38

145

-55°C to 150°C

1.75

6x10¹⁵

EB-404-1

4 months @ 25°C

10 Min @80°C

1.6

40,000

1/2 hr @ 150°C

39

51

130

-55°C to 150°C

1.2

3x10¹⁵

EB-414-1

1 year @

-40°C

12 Min @ 125°C

2.1

20,000

1/2 hr @ 150°C

35

48

124

-55°C to 150°C

1.6

2x10¹⁵

EB-407

1 year @

25°C

2 hrs @ 25°C

2.3

Paste

1/2 hrs @ 100°C

27

60

77

-40°C to 120°C

1.3

7x10¹⁵

EB-425

1 year @

25°C

>4 hrs @ 25°C

2.3

>250,000

2 hrs @ 100°C +

2 hrs @ 150°C

29

39

165

-55°C to 200°C

1.7

1x10¹⁶

EB-415-1

1 year @

-40°C

12 Min @125°C

2.2

>250,000

1/2 hr @ 160°C

24

35

142

-55°C to 150°C

1.9

2x10¹⁵